Soldering Tin Paste Mechanic Xg60
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MECHANIC
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Descripción
SOLDERING TIN PASTE MECHANIC XG60
Advanced insulation technology...High viscosity no-clean flux, can be used for PCB, SMD rework, as well as reballing of computer and phone chips.
A mixture of high-quality alloy powder and pasty resin flux, which prevents pale yellow residue, making the board easy to clean.
Super compactness:Solder paste for mobile phone PCB, SMD, PGA and computer among others.
-Helps repair circuit boards and protects electronic components
-Soldering Paste Flux - No need to clean solder
-Syringe solder paste is an ideal assistant for phone motherboard and mobile phone surface mount assemblies repair.
-The syringe plunger will provide premium activity levels with maximum wetting and extension, the 10cc syringe is available for all rework soldering and desoldering repairs.
*High quality, perfect performance, easy to weld.
*Suitable for mobile phone repair industry, digital computer service industry, high-precision circuit board SMD soldering, BGA soldering technology, etc.
